The pad pitch is 0.5mm! It is suitable for fine pattern products.
We would like to introduce our "Direct Imaging System." It is suitable for fine pattern products such as substrates with 0.3mm to 0.65mm pitch BGA and CSP, as well as flip chip mounted substrates. Additionally, it is applicable to products requiring high alignment accuracy. Please feel free to contact us when you need assistance. 【Features】 ■ High-difficulty fine patterns ■ Fine pattern formation ■ Resist formation *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■ Pad pitch: 0.5mm ■ Outer layer L/S: 60/70μm ■ Maximum board thickness: 1.6t ■ Pad diameter: φ0.3mm ■ Drill diameter: φ0.15mm ■ Number of layers: 4 layers to 12 layers ■ Material used: General FR-4, High Tg FR-4 ■ Special: 5μm copper foil for outer layer (peelable copper foil) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.