For 5G/6G! We will realize products that support advanced high-speed transmission technology.
We would like to introduce our support for high-speed and large-capacity transmission. We have developed products that are compatible with advanced high-speed transmission technologies for 5G/6G. We provide support for solving challenges related to the development of advanced high-frequency application substrates. Additionally, our "high-frequency printed circuit boards" can be tailored to meet your needs through the adoption of new high-frequency materials, joint evaluations, and the use of LP foils and low-dielectric glass materials. 【Features of High-Frequency Printed Circuit Boards】 ■ Proposals tailored to your needs ■ Surface treatment transmission LOSS evaluation ■ Analysis, evaluation, and deployment of finished products *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 ■ Zo matching of VIA ■ Transmission evaluation ■ Surface treatment proposals ■ Dielectric constant evaluation ■ High-frequency material application ■ Material composite ■ Waveform evaluation ■ Back drilling (stubless) ■ Copper foil profile elimination ■ Pattern Zo matching *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【For such concerns】 ■ I want to consider advanced high-frequency application substrates. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to keep the costs of high-speed high-frequency compatible substrates down. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within short delivery times. With many years of development and manufacturing experience, we have a strong track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement devices, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide variety of outsourcing needs. For any inquiries regarding mounting substrates or printed circuit boards, please feel free to contact us.