High multi-layer & high board thickness, terminal board thickness of 1.57mm, etc.! We can propose specifications according to your application.
We would like to introduce our "Multilayer Printed Circuit Board." It is possible to increase the number of layers according to the pin count of the mounted components (up to a maximum of 46 layers). The freedom of characteristic impedance wiring width has improved (interlayer thickness of 0.1mm or more is acceptable). We can propose specifications tailored to your applications, so please feel free to contact us with your requests. 【Features】 ■ It is possible to increase the number of layers according to the pin count of the mounted components (up to a maximum of 46 layers). ■ The freedom of characteristic impedance wiring width has improved (interlayer thickness of 0.1mm or more is acceptable). ■ The thickness of the inner layer copper foil can be increased for heat dissipation purposes. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Applicable Structural Examples】 ■Composite Board Thickness: Integration of different board thicknesses, terminal board thickness 1.57mm / maximum product board thickness 6.55mm composite ■Controlled Characteristic Impedance: Ensured interlayer thickness of 0.1mm, line width of 0.1mm or more ■BGA/CSP Mounted Components: Supports up to 2,500 pins, up to 44 layers ■Maintaining Insulation Reliability: Interlayer dielectric strength, resistance to CAF ■PF Through-Holes: Connector pin length adjustable to 1.6mm board thickness ■Inner Layer Copper Foil: 18/35/70μm, improved circuit temperature rise, cross-sectional area increase from 30℃ to 10℃, etc. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within short delivery times. With many years of development and manufacturing experience, we have a strong track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement devices, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide variety of outsourcing needs. For any inquiries regarding mounting substrates or printed circuit boards, please feel free to contact us.
![[Information] Introduction to Printed Circuit Boards for Space Use](https://image.mono.ipros.com/public/product/image/e41/2001025744/IPROS74561497085221636553.png?w=280&h=280)
