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  6. φ520mm - Large Printed Circuit Board Manufacturing Technology

φ520mm - Large Printed Circuit Board Manufacturing Technology

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last updated:Nov 06, 2023

OKI Circuit Technology Co., Ltd.
OKI Circuit Technology Co., Ltd.
  • Official site

Achieving high multi-layer printed circuit boards exceeding 500mm size! The maximum product size is 558×643mm.

We would like to introduce our "φ520mm - Large Printed Circuit Board Manufacturing Technology." We have achieved high multilayer printed circuit boards exceeding the 500mm size. Our high-precision lamination technology allows for narrow pitch specifications with a 0.5mm pitch. Main applications include semiconductor tester boards, load boards, probe cards, etc. Please feel free to contact us if you have any inquiries. 【Features】 ■ Maximum product size: 558×643mm ■ Maximum board thickness: 7.6mm (up to 96 layers with sequential structure possible) ■ High-precision lamination technology enables narrow pitch specifications with a 0.5mm pitch *For more details, please refer to the PDF document or feel free to contact us.

    Printed Circuit Board
φ520mm-大型プリント配線板製造技術.PNG

φ520mm - Large Printed Circuit Board Manufacturing Technology

φ520mm-大型プリント配線板製造技術.PNG
φ520mm-大型プリント配線板製造技術.PNG
  • Related Link - http://www.oki-otc.jp/

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basic information

【Overview】 ■Board Specifications ・Diameter: φ520mm ・Thickness: 7.6mm *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

[Examples of Application] ■ Semiconductor tester substrates, load boards, probe cards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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φ520mm - Large Printed Circuit Board Manufacturing Technology

φ520mm - Large Printed Circuit Board Manufacturing Technology

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OKI

OKI Circuit Technology Co., Ltd.

Electronic Components and Semiconductors

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OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within a short delivery time. With many years of development and manufacturing experience, we have a proven track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement equipment, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide range of outsourcing needs. For inquiries regarding mounting substrates and printed circuit boards, please feel free to contact us.

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