Microfabrication technology! Applying techniques such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!
Photofabrication is a precision machining technology that combines optical and chemical techniques to manufacture complex and intricate shapes with micron-level accuracy in a short time, without the use of molds. Unlike physical machining methods, this chemical or electrochemical machining method does not cause alteration or burr formation due to processing, and the processed parts can be brought closer together, making it widely used in the production of electrical components, electronic components, precision machine parts, and medical device parts, where precision and fineness are required. 【*Source: Photofabrication Association - Technical Explanation】
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basic information
Photofabrication is also known as Photo Etching, Photo Chemical Machining, and Photo Chemical Milling. Photofabrication involves two main methods: the first is the Photo Etching method, which forms an image on the surface of the material using photoresist through photographic techniques, and then chemically or electrochemically removes (etches) the areas not covered by the photoresist to manufacture the product. The second is the Photo Forming method (electroforming), where metal is deposited on the areas without photoresist (electroplating), and that deposited metal itself becomes the product. Additionally, in recent years, the Sandblasting method, which uses abrasive materials instead of etching solutions to manufacture products, has also become known.
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Photofabrication plays an important role as a production technology, producing precision machined parts such as lead frames, HDD suspensions, encoders, TAB tapes, various filters, and decorative items. Additionally, based on photofabrication technology, current cutting-edge technologies such as printed circuit boards, photomasks for LSI, color filters for color liquid crystal display devices, and semiconductors are also being developed.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*
