【TTL】Microfabrication technology! Applying techniques such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. It is optimal for testing fine-pitch insertion terminals and display lighting tests when combined with our contact clips and hand presses. *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

• Other electronic parts

Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs without the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

• Printed Circuit Board
• Other electronic parts
• Other cable related products

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

• Printed Circuit Board
• Circuit board design and manufacturing

The Hino Smart Cabinet provided by Nichinichi Shimizu Machinery Co., Ltd. is a material management solution that allows for the management of factory tools and consumables like a vending machine. This system automates inventory management and ordering processes, preventing the risk of production stoppages due to stockouts and significantly reducing the burden of inventory tasks. The cabinet comes in various types, such as drawer-type and spiral-type, allowing for the proper storage of drills, measuring instruments, protective gear, and more according to their intended use. Furthermore, the history management function through user authentication accurately tracks "who took out what and when," contributing to loss prevention and cost reduction. Operating 24/7 with no maintenance required, it is introduced as an efficient tool to promote the digital transformation (DX) of factories.

As we approach the season when temperatures drop, we invite those considering monitoring in "places where cameras are difficult to place," such as changing rooms and restrooms. The camera-free monitoring sensor "MotionCatch" detects human movement using millimeter-wave radar and AI. Since it does not record video, it can be placed in locations where installing a camera is challenging, such as changing rooms and private spaces. 【Capabilities】 - Detects falls and prolonged inactivity, sending notifications to the responsible person's PC or smartphone. - Can be used to monitor presence/absence and entry/exit. - Simply install on walls or ceilings. No wiring work is required (USB powered and Wi-Fi). - The detection range of one unit is approximately 6m x 4m, making it suitable for monitoring on a "room-by-room" basis rather than the entire floor. We are accepting inquiries regarding site condition checks and trial installations (Proof of Concept) in care facilities, public facilities, and accommodation facilities. *No video is recorded. This product is designed to assist in monitoring and is not a medical device. There may be instances where notifications do not reach you, and it is not a substitute for human observation.

In civil engineering sites, not only the strength and workability of the ground plates but also the management of materials after installation is important. Steel plates can potentially be converted into metal scrap, and in some locations, theft prevention measures may be necessary. Particularly in sites with little human traffic at night or in places where many ground plates are stored, the burden of management can increase significantly. Hyper CLT ground plates are wooden lightweight ground plates made from CLT, which is laminated wood in a perpendicular direction. Because they use wood, they are less likely to be targeted for metal theft compared to steel products, making it easier to manage materials in certain locations. A 5×10 plate weighs about 230 kg, while a 5×20 plate weighs about 460 kg. They can be utilized in temporary roads, access routes, heavy machinery work yards, material storage areas, and temporary parking lots. Of course, being wooden does not mean there is no concern about theft. Management tailored to the site environment is necessary. Hyper CLT ground plates are registered technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS as "TH-250021-A." Wooden ground plates, NETIS, civil engineering, CLT, wooden lightweight ground plates. From the perspective of protecting materials, we propose a new option.

B-Core Inc. will exhibit at the "6th Construction DX Exhibition [Tokyo]" held at Tokyo Big Sight from December 2 (Wednesday) to December 4 (Friday), 2026. The theme for this time is "Portable Site DX." We plan to introduce site-oriented solutions utilizing AI cameras and sensors, including a suitcase-type vehicle monitoring system and measurements of noise, vibration, and dust. ■ Exhibition Information https://bcore.biz/news/2026-10-06 ■ Our Company Invitation Visitor Badge (Pre-registration) https://www.japan-build.jp/tokyo/ja-jp/register.html?code=1800565883702314-WCL We look forward to your registration and attendance.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repair without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.