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  6. High-frequency compatible printed circuit board

High-frequency compatible printed circuit board

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last updated:Nov 06, 2023

OKI Circuit Technology Co., Ltd.
OKI Circuit Technology Co., Ltd.
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A printed circuit board that balances performance and cost! Correlated high-precision transmission line modeling.

We support the development of high-frequency substrates from materials, processes, and design. High-precision transmission line modeling correlated with in-house manufactured substrates. We can provide materials, treatments, and processes tailored to your applications. We offer printed circuit boards that balance performance and cost in a one-stop solution, so please feel free to contact us with your requests. 【Features】 ■ Manufacturing process compatible with high frequency - We propose suitable materials from the perspective of performance and cost - Improvement of characteristics through high-precision back drilling - 20% reduction in loss at 14GHz with changes to solder resist only ■ Support for chemically bonded surface treatments *For more details, please refer to the PDF document or feel free to contact us.

    Printed Circuit Board
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High-frequency compatible printed circuit board

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  • Related Link - http://www.oki-otc.jp/products/high_speed.html

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【Other Features】 ■ Support for millimeter-wave band substrates ■ Efforts to improve substrate model (simulation) accuracy *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency compatible printed circuit board

High-frequency compatible printed circuit board

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OKI

OKI Circuit Technology Co., Ltd.

Electronic Components and Semiconductors

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OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within a short delivery time. With many years of development and manufacturing experience, we have a proven track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement equipment, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide range of outsourcing needs. For inquiries regarding mounting substrates and printed circuit boards, please feel free to contact us.

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