Introducing two examples! Measures from troubleshooting for stable operation of various high-speed transmission circuit boards.
We would like to introduce our simulation case studies. In the case study titled "Provision of PCBs with Stable Operation for Various High-Speed Transmissions," we provide designs that operate from the perspective of design and manufacturing. This includes optimization of transmission line characteristics and verification of margins against standards. In the case study titled "Proposals for Countermeasures from Troubleshooting," we reproduced actual device malfunctions and clarified the mechanisms, demonstrating that DDR4 did not operate at the expected data rate through simulations that considered actual power and ground. [Case Overview: Provision of PCBs with Stable Operation for Various High-Speed Transmissions] ■ We provide designs that operate from the perspective of design and manufacturing. ■ Implementation details: - Optimization of transmission line characteristics: Impedance matching including vias and pads. - Verification of margins against standards: Selection and proposal of substrate and via structures. *For more details, please refer to the PDF document or feel free to contact us.
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【Case Summary: Proposal for Measures from Troubleshooting】 ■Reproduction of Actual Device Malfunction and Clarification of Mechanism ■Content - Reproduced the issue through simulation considering actual power supply and GND, as DDR4 did not operate at the expected data rate. ■Measures - Improvement confirmed by strengthening the GND pattern (return path) (issue resolved in the post-measurement board). *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within short delivery times. With many years of development and manufacturing experience, we have a strong track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement devices, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide variety of outsourcing needs. For any inquiries regarding mounting substrates or printed circuit boards, please feel free to contact us.