De-bonding! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of various materials such as metal and ceramics easily, cleanly, and efficiently.
The SQUADRO-M2 and SQUADRO-H2 are second-generation products of SQUADROM and SQUADRO-H, known for their excellent polishing performance. This innovative diamond grinding pad optimizes precision polishing of metals, hard materials, ceramics, and more. It combines the advantages of both SQUADRO-M and SQUADRO-H. The new manufacturing process allows for more flexible provision of products in various sizes. In terms of usage, the SQUADRO-M2 and SQUADRO-H2 maintain a high polishing rate until the moment they are finished, resulting in high surface quality. Due to their long product lifespan and ease of use, SQUADRO-M2 and SQUADRO-H2 offer an economical and efficient alternative to other grinding pads and traditional lapping methods. 【Features】 - Ideal for polishing metals, hard materials, ceramics, etc. - Compatible with all outer diameter sizes - Longer lifespan and more economical compared to other grinding pads - Cleaner than slurry lapping - High flatness and surface quality, precise edges - Easy detachment of abrasive grains can be achieved by adhering to the existing equipment's base plate 【Main Applications】 Please refer to the catalog.
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【Product Specifications】 - Diameter: 200~1,200mm *Sizes larger than this will be provided in multiple pieces that are bonded together. *We will manufacture to the size specified by the customer. - Diamond sizes: 3μm/6μm/15μm/30μm/60μm/(H only: 125μm) - Thickness: 0.6mm - Bonding materials: SQUADRO-M2: Resin bond / Medium hardness SQUDARO-H2: Resin bond / Hard - Carrier material: Polycarbonate - Back processing: Self-adhesive tape / Metal plate / Magnetic foil ■ SQUADRO is offered with three types of bonding materials based on application. SQUADRO-M / M2: A medium hardness bond that retains abrasive grains, suitable for precision grinding of metals, ceramics, and glass. SQUDARO-H / H2: A hard bond that retains abrasive grains, suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There are relatively large abrasive grains in O, and sizes up to 1μm in OWH.
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■Main Uses SQUADRO-M2: Precision grinding of metals SQUADRO-H2: Precision grinding of hard materials, ceramics, etc.
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Microdiamant, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate in-house know-how regarding final finishing CMP. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing because customers want to shorten the CMP process time. In the future, we will comprehensively handle consultations from grinding and polishing to CMP.