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  6. Diamond Grinding Pad 'SQUADRO-M2/H2'

Diamond Grinding Pad 'SQUADRO-M2/H2'

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SQUADRO-M2/H2

last updated:Jan 28, 2025

ピュアオンジャパン
ピュアオンジャパン
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De-bonding! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of various materials such as metal and ceramics easily, cleanly, and efficiently.

The SQUADRO-M2 and SQUADRO-H2 are second-generation products of SQUADROM and SQUADRO-H, known for their excellent polishing performance. This innovative diamond grinding pad optimizes precision polishing of metals, hard materials, ceramics, and more. It combines the advantages of both SQUADRO-M and SQUADRO-H. The new manufacturing process allows for more flexible provision of products in various sizes. In terms of usage, the SQUADRO-M2 and SQUADRO-H2 maintain a high polishing rate until the moment they are finished, resulting in high surface quality. Due to their long product lifespan and ease of use, SQUADRO-M2 and SQUADRO-H2 offer an economical and efficient alternative to other grinding pads and traditional lapping methods. 【Features】 - Ideal for polishing metals, hard materials, ceramics, etc. - Compatible with all outer diameter sizes - Longer lifespan and more economical compared to other grinding pads - Cleaner than slurry lapping - High flatness and surface quality, precise edges - Easy detachment of abrasive grains can be achieved by adhering to the existing equipment's base plate 【Main Applications】 Please refer to the catalog.

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SQUADRO-M2,H2 ロゴ入り.JPG

Diamond Grinding Pad 'SQUADRO-M2/H2'

SQUADRO-M2,H2 ロゴ入り.JPG
SQUADRO-M2,H2 ロゴ入り.JPG SQUADRO_M2_002.jpg Dressing stone.jpg Dressing stone and coolant.jpg SQUADRO-LUB+ JP.jpg
  • SQUADRO INTRO
  • Special site - Product/service details - https://pr.mono.ipros.com/pureon/product/

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【Product Specifications】 - Diameter: 200~1,200mm *Sizes larger than this will be provided in multiple pieces that are bonded together. *We will manufacture to the size specified by the customer. - Diamond sizes: 3μm/6μm/15μm/30μm/60μm/(H only: 125μm) - Thickness: 0.6mm - Bonding materials: SQUADRO-M2: Resin bond / Medium hardness SQUDARO-H2: Resin bond / Hard - Carrier material: Polycarbonate - Back processing: Self-adhesive tape / Metal plate / Magnetic foil ■ SQUADRO is offered with three types of bonding materials based on application. SQUADRO-M / M2: A medium hardness bond that retains abrasive grains, suitable for precision grinding of metals, ceramics, and glass. SQUDARO-H / H2: A hard bond that retains abrasive grains, suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There are relatively large abrasive grains in O, and sizes up to 1μm in OWH.

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■Main Uses SQUADRO-M2: Precision grinding of metals SQUADRO-H2: Precision grinding of hard materials, ceramics, etc.

catalog(12)

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【SQUADRO-M2/H2】Diamond Grinding Pad for Metal Materials

【SQUADRO-M2/H2】Diamond Grinding Pad for Metal Materials

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【SQUADRO-M/H】Diamond Grinding Pad for Metal Materials

【SQUADRO-M/H】Diamond Grinding Pad for Metal Materials

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【SQUADRO-G2】Diamond Grinding Pad for Glass Materials

【SQUADRO-G2】Diamond Grinding Pad for Glass Materials

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【SQUADRO-O/OWH】Diamond Grinding Pad for Optical Materials

【SQUADRO-O/OWH】Diamond Grinding Pad for Optical Materials

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Pure On Japan Co., Ltd. Company Profile

Pure On Japan Co., Ltd. Company Profile

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Polishing of aluminum nitride using diamond grinding pads from the processing data 【SQUADRO】.

Polishing of aluminum nitride using diamond grinding pads from the processing data 【SQUADRO】.

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Processing data: Polishing of BK7 glass using SQUADRO diamond grinding pads.

Processing data: Polishing of BK7 glass using SQUADRO diamond grinding pads.

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Processing data: Polishing of quartz glass using SQUADRO diamond grinding pads.

Processing data: Polishing of quartz glass using SQUADRO diamond grinding pads.

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Processing data: Polishing of blue plate glass using SQUADRO diamond grinding pads.

Processing data: Polishing of blue plate glass using SQUADRO diamond grinding pads.

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Processing data: Polishing of sapphire using diamond grinding pads (PLATO & SQUADRO).

Processing data: Polishing of sapphire using diamond grinding pads (PLATO & SQUADRO).

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Processing data: Polishing of SiC using diamond grinding pads (PLATO & SQUADRO).

Processing data: Polishing of SiC using diamond grinding pads (PLATO & SQUADRO).

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Easily attach and detach the pad!

Easily attach and detach the pad!

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News about this product(1)

We have revamped the catalog for the diamond grinding pad "SQUADRO"!

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We have renewed the catalog in conjunction with the product renewal of the diamond grinding pads "SQUADRO." If you wish, please download it from the catalog page for your use. 【Renewal Details】 *Applicable to SQUADRO-G2/M2/H2. ■ A new manufacturing process allows for quicker delivery times. ■ We can now provide pads in a single piece with outer diameters ranging from 200 to 1,200mm. * Sizes larger than this will be provided in multiple pieces that are bonded together. * We will manufacture to sizes tailored to customer specifications. 【Product Lineup】 SQUADRO-G2: A pad suitable for materials such as glass and lithium tantalate. SQUADRO-M / M2: Features a medium-hard bond that retains abrasive grains, making it suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: Retains abrasive grains with a hard bond, making it suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There is a relatively large abrasive grain size O, and sizes up to 1μm for OWH.

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ピュアオンジャパン

ピュアオンジャパン

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Microdiamant, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate in-house know-how regarding final finishing CMP. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing because customers want to shorten the CMP process time. In the future, we will comprehensively handle consultations from grinding and polishing to CMP.

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