*Heat-resistant and heat-conductive epoxy *Used for manufacturing heat sinks with excellent adhesion and low viscosity *High-performance material that passed NASA's outgassing test
This is a two-component epoxy adhesive containing aluminum, used for tools and parts that need to withstand high temperatures, or for materials requiring high thermal conductivity and heat resistance. It achieves excellent high thermal conductivity through its unique fillers, particle size, and dispersion technology. The 70-3812RNC is popular for various heat sink applications due to its good thermal conductivity. Common applications in heat sinks include bonding fins to bases, folding fin sets to bases, pin fin sets to bases, and cold plate tubes to extruded bases. It passes NASA's low outgassing test (ASTM E-595-07) and is suitable for use in outer space.
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basic information
【Specifications】 Color: Gray Viscosity after mixing (25℃): 8,000 cps Specific gravity (25℃): 1.81 Working time (100 grams, 25℃): 5 hours Shore D hardness: 25℃_90, 100℃_65 Tensile strength (psi, 25℃): 9,000 Compressive strength (psi, 25℃): 18,500 Mixing ratio (weight ratio): 100:10 Usage temperature (℃): -55 to +155 Coefficient of thermal expansion (℃): 28 x 10^-6 Thermal conductivity (W/m- °K): 4.5 Outgassing: %TML: 0.91, %CVCM: 0.07 【Curing Conditions】 25℃: 24 hours 65℃: 45 minutes 125℃: 15 to 20 minutes
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Applications/Examples of results
There is a popularity for various applications of heat sinks. Common applications in the manufacturing of heat sinks include fins and bases, foldable fin sets and bases, pin fin sets and bases, and the bonding of cold plate tubes and extruded bases. Additionally, bonding that requires thermal conductivity and use as a filler material are also possible.
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Company information
Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.
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