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  6. High-strength alumina substrate for thin films

High-strength alumina substrate for thin films

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last updated:Mar 29, 2024

JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
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Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.

The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.

    High frequency/microwave partsFine Ceramics
070320003_サイズ1Mb.jpg

High-strength alumina substrate for thin films

070320003_サイズ1Mb.jpg
070320003_サイズ1Mb.jpg
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●Features - High purity of alumina, excellent environmental resistance. - High strength, resistant to cracking even when the substrate is thinned. - Superior flatness and smoothness of the substrate surface, with few voids, making it suitable for thin film circuit formation. ●Applications Substrates for various temperature sensors, chip resistors, and high-frequency components. *As a substrate manufacturer, we are capable of comprehensive technology development, quality assurance, and problem-solving. We respond quickly to short lead times and design changes. Please feel free to consult with us.*

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● Boards for various temperature sensors ● Boards for chip resistors ● Boards for high-frequency components

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High-strength alumina substrate for thin films

High-strength alumina substrate for thin films

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Electronic Ceramics Comprehensive Catalog JFC

Electronic Ceramics Comprehensive Catalog JFC

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[Development Product] Step-type ceramic substrate and thin-film integrated circuit formation

[Development Product] Step-type ceramic substrate and thin-film integrated circuit formation

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Thin Film Integrated Circuit Components (MIC)

Thin Film Integrated Circuit Components (MIC)

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Fine patterning technology that achieves miniaturization and high precision.

Fine patterning technology that achieves miniaturization and high precision.

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[Design Examples and Technology Introduction] High-Frequency Solutions

[Design Examples and Technology Introduction] High-Frequency Solutions

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Company information

JAPAN

JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office

Ceramics

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As a member of JGC Group, JFC challenges the possibilities of the material of fine ceramics with our own technologies. We actively engage in fundamental and applied research on ceramics, product application development, as well as manufacturing and sales. We respond to the diverse needs of various advanced industries with our unique technologies and products, including high-frequency ceramic substrates and circuit components, ceramic parts for industrial machinery, and the prototyping and development of metal-ceramic composite materials (MMC).

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