Ideal for sealing the joints of enclosures and housings! Provides excellent shielding effectiveness.
The "SSP-N Series" is a shielded soft packing that can be easily cut, punched, or half-cut into any shape. Due to the electroless plating from the continuous foam holes of the urethane foam to the base non-woven fabric and the upper tricot (jersey), it exhibits very high shielding characteristics. The adhesive on the back of the base is processed in a striped pattern, so there is no conduction loss. 【Features】 ■ Exhibits very high shielding characteristics due to electroless plating ■ No conduction loss due to the striped pattern of the adhesive on the back of the base ■ Good shielding effect can be obtained when compressed ■ Suitable for sealing the seams of enclosures and housings ■ Easy to cut, punch, or half-cut into any shape *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Lineup】 ■SSP-010N ■SSP-020N ■SSP-030N *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Grounding and shielding of the enclosure ■ Shielding of the I/O panel section ■ Shielding of D-sub connectors ■ Shielding for computers, laptops, mobile phones, car navigation systems, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Takeuchi Industries pursues high performance and high quality in the electronics field, responding to a wide range of customer needs. We also accommodate special products, so please feel free to contact us.