Dichroic filter: Advanced color separation and synthesis are possible!

In recent years, with the miniaturization and enhancement of optical devices, there has been a growing demand for the deposition of dielectric multilayers on thin glass substrates and film substrates. However, challenges arise when the film stress generated during deposition causes the substrate to warp or the film to curl. Such deformations significantly impact product performance and processing accuracy, necessitating solutions. 【1】Challenges and causes of warping and curling due to film stress 【2】Innovations in deposition fixtures to suppress warping and their benefits 【3】The importance of controlling film stress through optimization of deposition conditions and case studies 【4】Support for cutting processes on thin substrates - Scribe & Dicing Summary For more details, please visit our company website.

The 2025 Osaka-Kansai Expo is a grand stage where cutting-edge technologies and cultures from around the world intersect. In particular, the pavilions of Middle Eastern countries such as Saudi Arabia, the UAE, Qatar, and Oman resemble a miniature future city, showcasing advanced architecture, smart energy, and AI-controlled urban infrastructure, allowing visitors to experience "future urban living." These Middle Eastern countries are actively promoting sustainable urban development and smart city initiatives, with significant expectations for industrial revitalization. Optical filters and thin-film technology can be applied across a wide range of fields, including renewable energy facilities, transportation infrastructure, healthcare, and security. Adachi New Industries aims to support the technological foundation of these future cities and contribute to industrial innovation on a global scale. 【1】 Experiencing the Future City at the Kansai Expo 【2】 The Role of Optical Thin Films in the Revitalization of Middle Eastern Industries 【3】 The Vision of Future Cities Shaped by Optical Technology 【4】 A Bridge of Friendship Through Optical Filters. For more details, please visit our company website.

At the 2025 Osaka-Kansai Expo, under the theme "Designing a Future Society Where Life Shines," various cutting-edge technologies, including space development, will be showcased. Several exhibits, including the "American Pavilion" and the "Gundam Pavilion," will focus on the theme of "space," allowing visitors to experience the presence of extraterrestrial worlds. These presentations go beyond mere entertainment and are deeply connected to the ongoing trends in space exploration and the space industry. Current space development is expanding beyond traditional satellite and probe operations to include a variety of missions such as deep space exploration, lunar base construction, manned missions to Mars, space resource mining, and space solar power generation. Many of these plans require optical technologies that can precisely control light across a wide range of wavelengths, including visible light, ultraviolet, and infrared. Among these, optical thin films are foundational technologies that support observational instruments, communication devices, and energy utilization systems. [1] The Intersection of Space Development and Optical Thin Films [2] The Functions of Optical Thin Films Required by the Space Environment (Technical Edition) [3] Optical Thin Films Active in Space (Case Study Edition) [4] -Future Outlook- The Expanding Role of the Space Industry and Optical Thin Films For more details, please visit our company website.

We have introduced the latest dicing cutting machine at the Higashi-Osaka factory of Adachi New Industry Co., Ltd. With this new equipment, Adachi New Industry Co., Ltd. can now achieve in-house processing from the design of optical thin films and metal pattern processing to film formation, etching, lift-off pattern processing, and chip creation, all in a consistent manner. We will strive to meet your expectations by aiming for even higher quality, precision, and stable supply. ■Specifications Maximum work size: φ8 inches (up to 141×141mm) Minimum cut size: 3×3 mm 　　　　　　　　　*We will achieve processing of even smaller sizes in the future. ■Processable substrates - Optical glass substrates (B270, D263, blue plate, quartz, etc.) - Silicon wafers *We also plan to gradually increase the types of processable substrates in the future.