Added 'Dielectric multilayer film deposition on thin substrates and warpage countermeasures' to the technology trend keywords.
In recent years, with the miniaturization and enhancement of optical devices, there has been a growing demand for the deposition of dielectric multilayers on thin glass substrates and film substrates. However, challenges arise when the film stress generated during deposition causes the substrate to warp or the film to curl. Such deformations significantly impact product performance and processing accuracy, necessitating solutions.
【1】Challenges and causes of warping and curling due to film stress
【2】Innovations in deposition fixtures to suppress warping and their benefits
【3】The importance of controlling film stress through optimization of deposition conditions and case studies
【4】Support for cutting processes on thin substrates - Scribe & Dicing
Summary
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