Consultation available for power supply units and clean classes! We can suggest suitable methods for the stripping process.
We would like to introduce our "Fully Automatic Peeling and Bonding Device." This device automatically peels off protective films (separators) and bonds them with high precision for main and sub-works flowing in from upstream. It is capable of simultaneous peeling and bonding on both sides. For heavier peeling forces, please feel free to consult us. 【Reference Specifications (Partial)】 ■ Bonding Position Accuracy: ±0.10mm in X1, Y1 directions ■ Cycle Time: Depends on material, adhesive type, and work size ■ Work Supply: Inline ■ Device Dimensions: L3000mm × W1500mm × H1900mm (including HEPA) ■ Compatible Work Size: Max L300 × 200mm (Maximum size achieved by peeling device: 1550 × 1300mm) * For more details, please refer to the related links or feel free to contact us. ■ Flexible substrates are also supported. ■ Sale of peeling units only is also possible.
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For more details, please refer to the related links or feel free to contact us.
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【Application of Adoption Results】 ■ Protective film (separator) peeling device & bonding device - OLED manufacturing, LCD manufacturing - DFPD manufacturing, electronic component manufacturing *For more details, please refer to the related links or feel free to contact us.
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Since our founding in 1976, we have been dedicated to creating machines that specialize in laminating labels, tapes, and films. Our products include labeling machines for mass production, printing systems, and the lamination of various films onto panels, which are essential for manufacturing electronic displays (such as OLEDs), automotive parts, pharmaceuticals, and medical devices. Thanks to our long-standing track record, we have earned a high level of trust from various manufacturing sites as "the experts in adhesion." The theme of "adhesion" presents infinite possibilities in manufacturing environments. If you are facing challenges with adhesion technology, please consult with us first.
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