This is a process that advances cracks in the substrate material by applying a load with a tool that has a diameter of 2mm.
"Scribe & Break" is a method for efficiently cutting materials such as glass, ceramics, and semiconductors. By utilizing the characteristics of materials that are hard and brittle, and taking advantage of crack propagation, it achieves a quality that differs from conventional processing techniques. If you have challenges with your current processing or want to change the quality, please feel free to contact us. 【Features】 ■ Completely dry processing ■ No kerf loss ■ High-speed processing ■ Reduced chipping ■ Reduced burrs on metal films ■ No thermal effects *For more details, please download the PDF or feel free to contact us.
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basic information
【Processable Materials】 ■ Alumina ■ LTCC ■ AlN ■ SiN ■ Zirconia ■ Dielectric ■ Glass ■ Sapphire ■ SiC, etc. *For more details, please download the PDF or feel free to contact us.
Price information
Low price, short delivery time, processing of just one piece, processing of broken circuit boards. Please feel free to let us know your requests.
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For more details, please download the PDF or feel free to contact us.
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Company information
Our company offers contract processing and chip sales of brittle materials using the new cutting technology "Scribe & Break." The advantages of "Scribe & Break" include 1) dry processing (no cleaning required), 2) no kerf loss, 3) reduced chipping and burrs, and 4) no thermal effects, among many others. We are particularly skilled in processing materials such as glass, ceramic substrates, and semiconductors (especially SiC and sapphire), so please feel free to entrust us with your needs. We respond to customer needs ranging from processing for test specimen production to product prototyping and mass production, cutting various materials. Please do not hesitate to contact us with your requests.