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  6. Cutting process using a wire saw

Cutting process using a wire saw

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last updated:Jun 26, 2025

アイテス
アイテス
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Cross-section preservation is possible! By dividing the sample with precision cuts using a wire saw, individual cross-sections can be produced.

We would like to introduce the cutting process using a wire saw at AITES Co., Ltd. With a wire saw, it is possible to create multiple cross-sections from a single sample by cutting and dividing it. Since it does not involve grinding, observations and analyses can be conducted again. Additionally, in cutting examples, even small and brittle white rice can be divided without causing cracks or chips. If you have any requests ranging from cutting processes to observations and analyses, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

    Processing Contractothers
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Cutting process using a wire saw

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2020-06-23_17h00_45.png 2020-06-23_17h01_02.png 2020-06-23_17h01_09.png
  • Related Link - https://www.ites.co.jp/section/index/%e5%8a%a0%e5%…
  • Special site - Product/service details - https://pr.mono.ipros.com/ites/product/

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Cutting process using a wire saw

Cutting process using a wire saw

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The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

TECHNICAL
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Overseas parts and products evaluation service

Overseas parts and products evaluation service

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Slice processing using Isomet.

Slice processing using Isomet.

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

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Regarding the curing temperature of epoxy resin during sample encapsulation.

Regarding the curing temperature of epoxy resin during sample encapsulation.

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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