Ideal for re-inspection of lot-out products and finish confirmation for each manufacturing lot!
"Wire Inspection Pro" is a technology that inspects the wire shapes inside IC chips using X-ray imaging and automatically determines defects such as wire bonding disconnections, shorts, and bends. By utilizing this technology, it is possible to automate the inspection of defects occurring inside ICs. Custom software can be developed based on the inspection object and inspection specifications. 【Features】 ■ By linking the developed wire inspection software with the X-ray inspection software (BSFM), automatic inspection of internal IC images is achieved. ■ Custom software can be developed based on the inspection object and inspection specifications. *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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【Applicable Uses】 ■ Inspection of defects inside IC chips that occur after wire bonding processes (such as IC molding) ■ Re-inspection of lot-out products ■ Confirmation of finishing for each manufacturing lot *For more details, please refer to the related links or feel free to contact us.
Company information
Our company is an electronic measuring instrument sales agency established in Yokohama in 1967. We handle current and voltage measuring instruments, frequency measuring instruments, noise and vibration measuring instruments, environmental testing machines, infrared thermography, and more, working to solve the challenges of a wide range of customers, including manufacturers of electrical products, automobile manufacturers, universities, and government agencies. Currently, we are supported by many customers at our nine domestic locations in Tokyo, Yokohama, Atsugi, Hamamatsu, Nagoya, Mie, Kyoto, Osaka, and Okayama, as well as two overseas locations.
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