Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.
In the era of IoT, we propose the use of copper inlay substrates and metal-based substrates for heat dissipation solutions, as well as ultra-thin substrates to enhance design flexibility for product miniaturization and thinness.
We solve your heat-related issues with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the heat generation of components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate specific shapes. 【Products Offered】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for double-sided boards to be affixed with heat dissipation sheets. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be shaped by bending. - The use of flexible resins and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.
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■Copper Inlay Substrate IoT devices, power substrates, high-frequency substrates, etc. ■Metal Base Substrate Power substrates, LED lighting, etc. ■Bendable Aluminum Substrate Automotive decorative accessories, design lighting, model lighting, etc. ■Thin Rigid Substrate Circuit substrates for ultra-thin high-density devices, etc.
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![High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"](https://image.mono.ipros.com/public/catalog/image/01/d07/317138/IPROS2918469235876260107.jpeg?w=120&h=170)
High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"
Company information
Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.