Display the void ratio relative to the component area in numerical form! Easy to cross-reference with data files.
The "Power Transistor Void Inspection Software" is a product that quantifies the soldering condition of transistors and IC chip components and displays the void rate. It identifies the shape of the mounted components and clearly displays the areas of voids that are not easily visible in relation to their surface area. It quantifies the void condition and shows the void rate relative to the component area. Additionally, matching with data files is straightforward. The data can display solder rates, NG judgments, inspection area sizes, solder area sizes, and more. 【Features】 - Recognizes component shapes by setting parameters - Capable of recognizing component shapes through image capture of Gerber data - Inspection can start simply by specifying the folder to be inspected - Displays in red if below the specified solder rate *For more details, please refer to the PDF document or feel free to contact us.
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Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.