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  6. Steady-State Thermal Conductivity Measurement Device / SS-H40 Product Catalog

Steady-State Thermal Conductivity Measurement Device / SS-H40 Product Catalog

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SS-H40

last updated:Nov 03, 2024

ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
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Equipped with pressure and thickness control functions! Suitable for thermal interface materials.

We aim to develop the optimal device for measuring thermal interface materials (TIM) used in semiconductor device heat dissipation. The steady-state thermal conductivity measurement device "SS-H40" is equipped with two measurement modes: "constant load mode" and "constant thickness mode," allowing for the evaluation of TIM in real-world usage conditions. In "constant load mode," measurements can be taken at a set load (units: N or Pa). On the other hand, "constant thickness mode" allows for measurements at a set thickness (units: mm). This enables measurements tailored to the usage environment, allowing for the assessment of whether the obtained thermal conductivity meets specifications. Furthermore, the measurement time, which previously took several hours, has been reduced to 10-20 minutes, making the process easier. 〇 About the Measurement Principle 〇 This is a steady-state measurement method. The steady-state method involves applying a constant amount of heat to the material, measuring the temperature gradient when the heat is stable, and determining the thermal conductivity of the material. This method maintains a steady-state heat flow, allowing for accurate measurements. It is a widely used measurement technique.

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Steady-State Thermal Conductivity Measurement Device / SS-H40 Product Catalog

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  • Related Link - https://hrd-thermal.jp/apparatus/ss-h40.html

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basic information

【Features】 〇 Fast measurement. The measurement time is short, ranging from 10 to 20 minutes. 〇 Simply place the sample; installation is easy. 〇 There are two measurement modes: "Constant Load Mode" and "Constant Thickness Mode." 〇 It is particularly strong in specific fields such as TIM (Thermal Interface Material), printed circuit boards, encapsulation resin, insulation materials, rubber, (adhesives), (grease), and others. <Collaborative Research Partner> Nagoya City Industrial Research Institute, System Technology Department, Production System Research Laboratory, Dr. Yoshinori Kajita (Ph.D. in Engineering)

Price information

Steady-State Thermal Conductivity Measurement Device SS-H40 9.8 million yen *Excluding tax and delivery costs. *Please contact us separately for optional items. Custom products are also available. The price for custom products varies depending on specifications, so please inquire. *For inquiries regarding compliance with various standards such as ASTM, JIS, ISO, etc., please contact us.

Price range

P6

Delivery Time

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※4 months

Applications/Examples of results

Example applications: - Measuring thermal conductivity under pressure. - Measuring thermal conductivity by changing the contact state. - Measuring thermal conductivity by changing the temperature. - Measuring the time-dependent changes in thermal conductivity. - Measuring for the development of heat dissipation materials. * We support both equipment sales and measurement requests. Examples of measurement targets: - Thermal pads (hard type / soft type) - Gap fillers - Phase change materials - Die attach materials - Thermal conductive grease - Thermal conductive adhesives - Encapsulating resins

Detailed information

  • 定常法の測定原理.jpg

    Measurement principle of the heat flow meter method. For details, please contact us.

  • 定常法 サーマルパッドの測定.jpg

    Measurement of thermal pads. For details, please contact us.

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ASTM D5470 compliant product Custom ASTM D5470 compliant products are also available.
Various custom products Customizations tailored to customer needs are possible.

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Steady-State Thermal Conductivity Measurement Device / SS-H40

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News about this product(1)

Panel exhibition of 'Thermal Property Measurement Device' at the 'Japan Society of Mechanical Engineers Thermal Engineering Conference 2024' [Free consultation]

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We will introduce three models of the "Thermal Property Measurement Devices" from Bethel Hudson Research Institute in a panel exhibition. The following three models are scheduled for introduction: ◇ Steady-State Thermal Conductivity Measurement Device SS-H40 ◇ ThermoWave Analyzer TA ◇ Thermal Microscope TM3 *——————————————————————* "Japan Society of Mechanical Engineers Thermal Engineering Conference 2024" ・Date: October 5 (Saturday) - 6 (Sunday), 2024 ・Location: KDDI Ishin Hall (Yamaguchi Prefecture) *——————————————————————* For more details, please check the Japan Society of Mechanical Engineers website. https://www.jsme.or.jp/conference/tedconf24/index.html

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Company information

ベテル

ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場

Manufacturing and processing contract

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Leveraging the assembly technology cultivated over many years, we have expanded our business areas to include the development of precision component assembly, thermal property measurement devices, contract measurement services, and the development of medical and dental plastic products equipped with clean rooms. We deepen and integrate our "original products" from a unique manufacturing perspective, consolidating our know-how and technology. With "speedy decision-making and execution," which is a strength unique to Bethel, we provide high-quality products under the "Made by BETHEL" label. Our wish at Bethel is for our customers who use Bethel products to be satisfied with our products, manufacturing, and services, and to feel that they made the right choice in trusting our company. Furthermore, we hope that the satisfaction of our customers will lead to the happiness of each employee who works here.

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