Panel exhibition of 'Thermal Property Measurement Device' at the 'Japan Society of Mechanical Engineers Thermal Engineering Conference 2024' [Free consultation]

We will introduce three models of the "Thermal Property Measurement Devices" from Bethel Hudson Research Institute in a panel exhibition. The following three models are scheduled for introduction:
◇ Steady-State Thermal Conductivity Measurement Device SS-H40
◇ ThermoWave Analyzer TA
◇ Thermal Microscope TM3
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"Japan Society of Mechanical Engineers Thermal Engineering Conference 2024"
・Date: October 5 (Saturday) - 6 (Sunday), 2024
・Location: KDDI Ishin Hall (Yamaguchi Prefecture)
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For more details, please check the Japan Society of Mechanical Engineers website.
https://www.jsme.or.jp/conference/tedconf24/index.html


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