Reproducibility in sample grinding
By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.
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basic information
● Our precision polishing system employs a diamond wrapping method. ● The polishing disk is made of a composite material that is most suitable for precision polishing using diamond abrasives. ● The polishing disk has minimal thermal deformation and can maintain flatness during polishing, achieving a surface roughness of less than 1nm depending on the polishing conditions. ● By attaching an attachment, flatness maintenance and correction can be performed with reproducibility. This operation allows for the possibility of bringing the disk's surface runout close to zero. The attachment can only be mounted on e-type devices (MA-200e, MA-300e, MA-400e). ● The polishing device is designed structurally to guarantee high precision, with surface runout finished to within 5μm. ● We offer a wide range of sample holders and can propose the most suitable products. High-precision holders that allow for removal amounts to be set in 1µm increments, as well as TEM holders ideal for preparing samples for TEM observation, and various other holders such as vacuum chuck holders and holders with diamond stoppers are available.
Price information
Please consult us as the composition may vary significantly depending on the sample being processed.
Delivery Time
P4
※Delivery times may vary depending on stock availability.
Applications/Examples of results
● Flattening and thinning of semiconductor wafers with a diameter of 6 inches and 8 inches ● End face polishing of optical fiber components ● Mirror finishing of optical materials ● Sample preparation for crystal analysis ● Thinning of biological samples ● Sample preparation for TEM and SEM ● From coarse polishing to CMP
Detailed information
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This is an image of the MA-200e in actual operation. By using the SD-200 (forced drive oscillation unit), the entire polishing plate is utilized without any localized unevenness. Additionally, by maintaining a constant rotation speed of the sample holder, highly reproducible sample polishing can be achieved.
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The touch panel enables simple operation. You can set the rotation speed of the grinding wheel and the timer duration.
Line up（5）
| Model number | overview |
|---|---|
| MA-150 | Can polish samples up to approximately Φ50mm |
| MA-200e | Can polish samples up to approximately Φ100mm |
| MA-300e | Can polish samples up to approximately Φ150mm |
| MA-400e | Can polish samples up to approximately Φ200mm |
| MA-600e RECT | Can polish samples up to Φ600mm |
catalog（1）
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Company information
Our company has been manufacturing polishing equipment, cutting machines, and scribers suitable for precision machining using the technical know-how we have cultivated over many years. We have a significant track record, particularly in cutting-edge technology fields such as semiconductors, ceramics, and optical communications. In addition to standard specification equipment, we also accept the design and manufacture of custom specifications tailored to our customers' needs. To meet the increasing demands for precision in machining and the diversifying needs, we will continue to advance with innovative ideas and technology.