Hirosaki Univ. Technology : Thin and flexible force sensor Related patents (1/4):K23-011_K23-022_K23-030_K24-002
Thin, highly integrated sensor capable of measuring low stress range
Measurement of shear stress and contact stress provides important information in various fields such as robotics, medical, digital, and direct skin contact product development Conventional triaxial stress sensors have thick and rigid shapes, so it has been difficult to directly measure shear stress and contact stress in vivo, for example. In order to solve the above problems, the inventor has developed the following sensors. 1. Patent No. JP5688792 * Related Patent (2/4) Thin sensor capable of measuring shear stress and contact stress simultaneously 2. Patent No. JP6753615 * Related Patent (3/4) Highly integrated sensor technology 3. Patent No. JP7466214 * Related Patent (4/4) A laminated sensor capable of measuring even in a low stress range based on the principle of 1. The present invention is a thin, highly integrated sensor combining the above technologies. Demonstration experiments for various applications have been conducted, and the practical application of this technology is expected.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
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