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  1. Home
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  3. Electronic Components and Modules
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  5. Circuit board design and manufacturing
  6. End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

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last updated:Feb 06, 2025

三和電子サーキット
三和電子サーキット
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We will solve the implementation issues and challenges arising from the miniaturization of electronic components with our special structures such as edge-through-hole boards and laminated boards.

End face through holes are formed by cutting through holes created at the edges of the substrate using contour processing. Traditionally, copper burrs were generated during the cutting of through holes, but our company can provide end face through holes without burrs even with router processing thanks to our unique process. Additionally, this unique process allows for the partial etching of landless through holes and the copper plating of through holes. In printed circuit boards for electronic device applications such as compact modules, miniaturization and heat dissipation are required. Our company offers special structure printed circuit boards tailored to your needs, such as metal cavity structure boards and three-dimensional structure boards through lamination.

    Circuit board design and manufacturing
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End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

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  • Related Link - https://se-circuit.co.jp/

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basic information

◇End Face Through Hole Board 【Specifications】 ■Base Material: FR-4 ■Hole Diameter: φ0.6 to φ2.0mm ■Board Thickness: 0.5 to 1.6mm ■Number of Layers: Double-sided, 4 layers ■Outline Processing: Router, Mold ◇Narrow Pitch Through Hole ■Base Material: FR-4 ■Hole Diameter: φ0.15mm and up ■Hole Pitch: 0.6mm ■Outline Processing: Router ◇Partial Etching Through Hole ■Please feel free to contact us for any requests. ◇Bonded Special Structure ■Please feel free to contact us for any requests. *Please feel free to contact us for inquiries beyond the specifications above.

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Applications/Examples of results

Small module circuit board Power supply unit Converter circuit board Devices (sensors, chip components, etc.)

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Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

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End face electrode (end face through hole, burr prevention, soldering measures)

End face electrode (end face through hole, burr prevention, soldering measures)

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Substrate Variations <Bonded Substrate・Side Coated Substrate>

Substrate Variations <Bonded Substrate・Side Coated Substrate>

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Company information

三和電子サーキット

三和電子サーキット

Electronic Components and Semiconductors

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Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.

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