Increase in bond numbers, shortening of cleaning cycles, improvement in productivity!
This document is an explanatory material about heavy wire wedges. It includes features of chip design aimed at reducing buildup, as well as key development activities. With MPP's unique chip design, buildup and wear are minimized, enhancing performance and durability. [Contents] - Challenge: Improvement of MTBA - Features of chip design to reduce buildup - Features of chip design to decrease buildup - Key development activities - Value proposition *For more details, please download the PDF or feel free to contact us.
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Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.