Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
This product is an advanced tabletop wedge wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It allows for Y-direction table movement settings via parameters, making bonding of pitch wires and parallel wires easy. Parameter import and export using USB is possible. 【Features】 ■ Supports copper wire bonding ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height for improved flexibility ■ Ergonomically designed for ease of use *You can download the product documentation (PDF) from the link below.
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basic information
The Z-axis motion and bond load, which greatly affect bondability, are all computer-controlled, so there is no difference in bondability due to the operator. 【Other Features】 ■ Comprehensive solution: machine, tools, application-specific development, services ■ Service plans (Silver, Gold, Platinum) ■ Trade-in options & rental options ■ Year-round online technical support ■ Profiles for special wire bonding * You can also download the PDF materials from below.
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Applications/Examples of results
【Applications】 ■ Optoelectronic modules ■ Hybrid/MCM ■ Microwave products ■ Chip on board, etc. * You can also download the PDF materials from below.
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.
![[Information] About the bonding interface of Cu wire bonding](https://image.mono.ipros.com/public/product/image/868/2000495974/IPROS78843622833111926469.png?w=280&h=280)
