Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
This product is an advanced tabletop ball wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It comes standard with ESD coating and is suitable for R&D and small-scale production. By using only the minimum necessary parameters, it allows for easy adjustment of bonding parameters. 【Features】 ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height enhances flexibility ■ Compatible with copper wire bonding * You can download the product documentation (PDF) from below. * If you have any questions about the product or require support after installation, please feel free to contact the person in charge below.
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basic information
Additionally, by using the same parts as the K&S automatic machines, we achieve a balance between the ease of manual machines and the high reliability of automatic machines. 【Other Features】 ■ Compatible with a wide range of wire and ribbon sizes ■ Comprehensive solutions: machines, tools, application-specific development, services ■ Service plans (Silver, Gold, Platinum) ■ Trade-in options & rental options ■ Year-round online technical support ■ Profiles for special wire bonding *You can also download the PDF materials from below.
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Applications/Examples of results
【Applications】 ■ Optoelectronic modules ■ Hybrid/MCM ■ Microwave products ■ Chip on board, etc. * You can also download the PDF materials from below.
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.
![[Information] About the bonding interface of Cu wire bonding](https://image.mono.ipros.com/public/product/image/868/2000495974/IPROS78843622833111926469.png?w=280&h=280)
