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  6. AMD Ryzen 8000 equipped with COM Express

AMD Ryzen 8000 equipped with COM Express

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conga-TCR8

last updated:Dec 13, 2024

コンガテックジャパン
コンガテックジャパン
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AMD Ryzen 8000 equipped COM Express Compact Type 6 module: conga-TCR8

The 【conga-TCR8】 is a COM Express Compact Type 6 module equipped with the AMD Ryzen Embedded 8000 processor series. The processor can be selected from four types (6 or 8 cores), featuring up to 8 Zen 4 cores, integrated AMD Radeon RDNA 3 graphics, and an AMD XDNA NPU. It supports up to 128GB of DDR5 RAM (up to 5600 MT/s, with ECC as an option) through two SO-DIMM sockets, and it can optionally include an onboard NVMe SSD. The TDP is scalable from 15 to 54W, making it suitable for upgrading existing products. It provides up to 39 TOPS of performance for AI inference, making it ideal for edge AI applications that require high computing power, combining the latest AI and graphics in cost-sensitive mass production. Its applications include medical imaging, testing and measurement, AI-based POS, and high-end gaming.

    Other electronic partsMicrocomputerEmbedded Board Computers
IM2470-conga-TCR8.jpg

AMD Ryzen 8000 equipped with COM Express

IM2470-conga-TCR8.jpg
IM2470-conga-TCR8.jpg
  • Related Link - https://www.congatec.com/jp/products/com-express-t…

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Form Factor: COM Express Compact Type 6 Processor: AMD Ryzen Embedded 8000 Processor Series (8640U, 8645HS, 8840U, 8845HS) Memory: 2x SO-DIMM sockets DDR5, up to 128 GB | up to 5600 MT/s | ECC (option) Ethernet: 2.5 GbE I/O: 4x USB 3.2 Gen2, 4x USB 2.0 2x SATA 6Gb/s (if NVMe SSD option is not used) 6x PCIe Gen4 (8 lanes), PEG x8 Gen4 1x I²C bus, 1x GPSPI, 2x UART, 8x GPIO, 1x SM-Bus, 1x LPC Mass storage: NVMe SSD up to 1 TB capacity (option instead of SATA ports) Graphics: AMD Radeon RDNA 3 NPU/AI Acceleration: XDNA NPU

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Medical imaging, testing & measurement, AI-based POS, high-end gaming, edge AI applications, etc.

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COM Express Compact Type 6 Module: conga-TCR8 Datasheet

COM Express Compact Type 6 Module: conga-TCR8 Datasheet

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COM Express: conga-TC675 Datasheet

COM Express: conga-TC675 Datasheet

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COM Express: conga-TC675r Datasheet

COM Express: conga-TC675r Datasheet

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COM Express Compact Type 6 Module: conga-TC700 Datasheet

COM Express Compact Type 6 Module: conga-TC700 Datasheet

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COM Express Type 6 Evaluation Board: conga-TEVAL/COMe 3.0 Datasheet

COM Express Type 6 Evaluation Board: conga-TEVAL/COMe 3.0 Datasheet

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COM Express Type 6 Evaluation Board: conga-TEVAL3/COMe3.1 Datasheet

COM Express Type 6 Evaluation Board: conga-TEVAL3/COMe3.1 Datasheet

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[White Paper] COM Express Type 6 and COM-HPC Client

[White Paper] COM Express Type 6 and COM-HPC Client

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Product Guide: Product Highlights 2025

Product Guide: Product Highlights 2025

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News about this product(2)

[News] Embedded Technology Blog Japanese Version Volume 10 Released!

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The website of Congatec features a blog (in English) by experts in embedded computing and edge computing. The Japanese translations are published periodically on the following site: https://www.incom.co.jp/corporation/custom.php?company_id=4735&custom_page_id=631 The 10th installment is about the conga-TCR8 module equipped with AMD Ryzen Embedded 8000, which won the "Embeddy Award." Check out the highlights of products for edge AI. 【Currently Published Blogs】 1. COM-HPC Mini - Part 1: Size 2. COM-HPC Mini - Part 2: Pinout : 7. COM-HPC Mini - Part 3: Cooling : 10. From an Unsung Hero to an Award-Winning Star: Spotlight on Congatec's conga-TCR8 We hope this will be helpful for your embedded system development and new projects.

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conga-TCR8

[Press Release] Congatec announces a new COM Express Compact module equipped with AMD Ryzen Embedded 8000 series for high-performance AI applications at the edge.

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congatec, a leading vendor of embedded and edge computing technology, announces a new COM Express Compact computer-on-module featuring AMD Ryzen Embedded 8000 series processors. The new module, equipped with up to 8 "Zen 4" cores and an innovative XDNA NPU, along with powerful Radeon RDNA 3 graphics, delivers exceptional performance in AI inference with up to 39 tera-operations per second (TOPS). Read the full press release here: https://bit.ly/3MQ4cjL

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コンガテックジャパン

コンガテックジャパン

Electronic Components and Semiconductors

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Congatec is a manufacturer based in Germany that specializes in products for embedded computing, including standard form factor computer-on-modules such as COM Express, COM-HPC, and Qseven, SMARC according to SGET standards, as well as single-board computers (SBCs). In addition to manufacturing and selling board modules, they also offer services such as custom design and development, as well as product lifecycle management. Congatec's products, which are a trusted leading supplier in the embedded industry, are manufactured according to the latest quality standards and are designed to be robust and long-term supply capable. They are used in a wide range of applications across various fields, including industrial automation in harsh environments, medical imaging, transportation, telecommunications, testing and measurement, as well as smart factories, AI-based quality inspection, vision systems, collaborative robots, autonomous vehicles, and video security.

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