Microprocessor technology has completed a compact, lightweight, and highly accurate crack depth measurement tool.
Microprocessor technology has completed a compact, lightweight, and high-precision crack depth measurement tool. It is ideal for measuring the depth of fatigue cracks, as well as for depth measurements after magnetic and ultrasonic testing, and for measuring crack depths in rolls and molds. ■ Features ● Applicable to both magnetic and non-magnetic materials ● Easy measurement: Simply place the probe needle on the crack for digital direct reading ● Digital, pocket-sized, high precision ● Robust shock-resistant design, drip-proof structure ● Built-in data logger (up to 3850 points) with 300 types of batch processing available; PC data processing software with RS232C output also available (optional) ● The probe pin is detachable and replaceable
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basic information
By measuring the depth of cracks, the following can be achieved: 1. Determining whether to repair or replace parts on the manufacturing line. 2. Understanding the progression of cracks during maintenance inspections to decide when to repair or replace equipment. 3. Determining the quality of manufactured products. * Easy and accurate measurement with a spring-loaded pin. * Correction data recorded within the probe for improved accuracy. * Accurate measurement of materials like SUS through multi-point calibration.
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Crack depth measurement
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