High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.
Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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【Usage Scenarios】 ■Product-specific / Minimum Through Hole Pitch ・Probe Card: 0.65mm ・CSP Main: 0.40mm ・Performance Board: 0.50mm ・Burn-in Board: 0.40mm ■Drilling Specifications ・Minimum φ0.10 to Maximum φ6.2 ■Filling Specifications ・Minimum φ0.15 to Maximum φ0.8 ■Wiring Density (L/S) ・Inner Layer 18μm: 50/50μm 35μm: 60/70μm ・Outer Layer 60μm: 100/100μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company, as a supporter of social infrastructure, quickly captures market needs and provides products that satisfy our customers. Society as a whole is showing structural changes towards a new normal, accompanied by the acceleration of digital transformation (DX). We are addressing this change by inheriting the technical strengths we have cultivated so far and engaging in research and development to solve social issues and "create a safe and secure society." We focus on advanced technological areas to realize safe, secure, and sustainable social infrastructure.
