Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

Circuit board design and manufacturing