Proposal for thermal management of electronic devices and solutions for heat dissipation.
Mass production of copper coin printed circuit boards is possible for high multilayer substrates that require heat dissipation and thermal management. High heat dissipation is achieved with a uniquely developed copper coin structure.
Our company is capable of providing copper coin※ (heat dissipation structure) wiring boards. With the advancement of 5G communication devices, thermal management of high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. ※Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Unique development of equipment for embedding copper coins, allowing flexible adaptation to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.
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【Heat Dissipation Evaluation by Structure】 <Item: Conditions> ■Humidity: 45% ■Room Temperature: 23℃ ■Power Consumption: 5W ■Temperature Measurement Area: Chip Component Reference: Thermal Conductivity of Copper (390W/m·K) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company, as a supporter of social infrastructure, quickly captures market needs and provides products that satisfy our customers. Society as a whole is showing structural changes towards a new normal, accompanied by the acceleration of digital transformation (DX). We are addressing this change by inheriting the technical strengths we have cultivated so far and engaging in research and development to solve social issues and "create a safe and secure society." We focus on advanced technological areas to realize safe, secure, and sustainable social infrastructure.