Thermal management and heat dissipation materials for 5G communication devices.
Neotechnology
Investigation Report on Thermal Management and Heat Dissipation Materials for 5G Communication Equipment: Trends in Electronic Patent Technology
You can view patent information categorized by the following technologies: - High-frequency circuit boards - TIM (Thermal Interface Material) - Antenna modules - Optical communication - Vehicle communication - Vapor chambers
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basic information
WEB version With the spread of mobile communications and IoT, the fifth generation mobile communication system, which enables high-speed, large-capacity, low-latency connections with many simultaneous connections, is becoming widespread. In high-speed communication using millimeter waves, the heat dissipation technology of high-density integrated semiconductor devices has become crucial. [Investigated Patent Technologies] We focused on patent information related to infrastructure technologies for 5G communication, centered around semiconductor devices necessary for high-speed, large-capacity signal processing, the substrates on which they are implemented, peripheral devices for cooling these semiconductor devices, and transmission and reception equipment for processing high-frequency signals. Additionally, we examined patent information related to application technologies such as radar devices for vehicles for autonomous driving and cooling devices for mobile terminals.
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Dynamic Map: [Price] 180,000 yen + tax Patent Guidebook: [Price] 80,000 yen + tax University Patent: [Price] 30,000 yen + tax All companies tackling the focus market: [Price] 30,000 yen + tax NEO Report: [Price] 180,000 yen + tax Web preview is available. We will introduce the actual products. Please feel free to consult with us.
Price range
P3
Delivery Time
P2
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