The thermal conductivity is 1.5 to 3.0 W/m*K, making it suitable for optical products and sensitive electronic components.
The "N-putty series" is a liquid non-silicone thermal interface material made from non-silicone resin. Since there is no volatilization of low molecular siloxane, it does not lead to poor electronic circuit connections. Additionally, N700 has flexible properties with good thermal conductivity and low thermal resistance. The thermal conductivity ranges from 1.5 to 3.0 W/m*K, making it suitable for optical products and sensitive electronic components, and it is an appropriate product for automated production lines using our developed dispenser. 【Product Lineup】 ■N-putty ■N-putty2 *For more details, please download the PDF (English version) or feel free to contact us.
Inquire About This Product
basic information
For more details, please download the PDF (English version) or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF (English version) or feel free to contact us.
Company information
Asahi Ritsu proposes thermal solutions for lightweight, slim, and high-power modules. Our long-standing excellent research and development team quickly provides thermal solutions and can meet the special needs associated with customer product development.
![[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)](https://image.mono.ipros.com/public/product/image/08c/2001440591/IPROS40565002714052496557.jpeg?w=280&h=280)
