Support for high-density substrates! We offer a diverse lineup tailored to your needs.
We would like to introduce our high-density substrate compatible 2D/3D inspection equipment, the 'RSH Series'. It supports the miniaturization of bump diameter/pitch. We have a diverse lineup tailored to your needs. Please feel free to contact us when you need assistance. 【Features】 ■ Ultra-fast and high-precision inspection ■ Simultaneous measurement system for 2D/3D ■ Supports miniaturization of bump diameter/pitch *For more details, please download the PDF or feel free to contact us.
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【Lineup】 ■RSH-4 ■RSH-12 ■RSH-23 ■RSH-50 *For more details, please download the PDF or feel free to contact us.
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.