We can propose specifications tailored to your needs! We provide printed circuit boards with structures customized for your applications.
We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.
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【Other Usage Scenarios】 ■ Hole Drilling Specifications - Minimum φ0.10 to Maximum φ6.2 drill ■ Hole Filling Specifications - Minimum φ0.15 to Maximum φ0.8 drill ■ Wiring Density (L/S) - Inner Layer 18μm: 50/50μm - 35μm: 60/70μm - Outer Layer 60μm: 100/100μm ■ Minimum Pad Pitch - 0.15mm pitch / Pad φ0.08 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company, as a supporter of social infrastructure, quickly captures market needs and provides products that satisfy our customers. Society as a whole is showing structural changes towards a new normal, accompanied by the acceleration of digital transformation (DX). We are addressing this change by inheriting the technical strengths we have cultivated so far and engaging in research and development to solve social issues and "create a safe and secure society." We focus on advanced technological areas to realize safe, secure, and sustainable social infrastructure.