High current, high voltage, and high heat dissipation compatible printed circuit board.
For thick copper foil circuit boards, metal core circuit boards, and metal base circuit boards! Pre-shipment inspection possible with dielectric strength testing.
This is an introduction to printed circuit boards designed to solve issues related to high current, high voltage, and heat dissipation. They can be used for thick copper foil boards, metal core boards, and metal base boards. We can conduct high current (up to 400A) conduction tests in-house. 【Features】 ■ Pre-shipment inspection possible with dielectric strength testing ■ Multi-layer formation with conductor thickness up to 500μm ■ Production of products with 2.5mm metal is possible ■ In-house high current (up to 400A) conduction testing available *For more details, please refer to the PDF document or feel free to contact us.
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【Customer Concerns】 ■ Want to carry large currents ■ Insulation failure when applying high voltage ■ High assembly labor for busbars ■ Mounting defects due to warping of printed circuit boards caused by heat *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ Thick copper foil printed circuit boards - High current applications (busbar replacement, cable replacement) - Power supplies, chargers, fuse boxes ■ Metal core printed circuit boards - Noise prevention, component heat dissipation ■ Metal base printed circuit boards - Heat dissipation applications (heat sinks) *For more details, please refer to the PDF document or feel free to contact us.
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Our company, as a supporter of social infrastructure, quickly captures market needs and provides products that satisfy our customers. Society as a whole is showing structural changes towards a new normal, accompanied by the acceleration of digital transformation (DX). We are addressing this change by inheriting the technical strengths we have cultivated so far and engaging in research and development to solve social issues and "create a safe and secure society." We focus on advanced technological areas to realize safe, secure, and sustainable social infrastructure.