We will introduce methods for heat dissipation in printed circuit boards.
As components and enclosures become smaller, the surface area of components decreases, and the lack of area to dissipate heat from ICs needs to be compensated by the substrate. At Oki Electric Industry, we have realized a structure that locally dissipates heat by embedding cylindrical copper into printed circuit boards, maximizing the thermal conductivity of copper (approximately 390W/m·K). 【Features】 ■ Embedding copper coins in heat-generating areas to efficiently utilize copper's thermal conductivity (390W/m·K) for heat dissipation. *For more details, please refer to the PDF document or feel free to contact us.
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【Heat Dissipation Evaluation by Structure】 <Items/Conditions> ■Humidity: 45% ■Room Temperature: 23℃ ■Power Consumption: 5W ■Temperature Measurement Area: Chip Component *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company, as a supporter of social infrastructure, quickly captures market needs and provides products that satisfy our customers. Society as a whole is showing structural changes towards a new normal, accompanied by the acceleration of digital transformation (DX). We are addressing this change by inheriting the technical strengths we have cultivated so far and engaging in research and development to solve social issues and "create a safe and secure society." We focus on advanced technological areas to realize safe, secure, and sustainable social infrastructure.