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  6. Plate-shaped alumina particles PWA

Plate-shaped alumina particles PWA

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last updated:May 21, 2025

フジミインコーポレーテッド
フジミインコーポレーテッド
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These are alumina particles with a high aspect ratio and a purity of 99.0% or higher. They are also suitable as fillers for electrical insulation and wear resistance!

PWA is a high-quality alumina powder composed of plate-like crystals with an Al2O3 purity of 99.0% or higher. Alumina is excellent in heat resistance and electrical insulation, and it is chemically inert, unaffected by acids or alkalis. It also has a hardness second only to silicon carbide. For this reason, it is expected to be used as a filler material (filling material, heat dissipation (thermal conductivity)) aimed at providing insulation and wear resistance. Our plate-like alumina has the following features: 1) Unique shape: high aspect ratio plate-like 2) Lineup: average particle size ranging from 3µm to 30µm 3) Sharp particle size distribution: our proprietary classification technology [Expected Applications] - Filler material: providing insulation and wear resistance - Providing low aggressiveness to the counterpart - Providing optical properties (such as light diffusion)

    Fine Ceramics
PWA粒子.jpeg

Plate-shaped alumina particles PWA

PWA粒子.jpeg
PWA粒子.jpeg PWAカタログ.jpg
  • [Our Company Website] Introduction to PWA's plate-shaped alumina particles is here.
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Introduction of rod-shaped zinc oxide for heat dissipation and thermal conductivity filler.

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Introduction of a new proposal for solid lubricant: Plate-shaped titanium phosphate.

Introduction of a new proposal for solid lubricant: Plate-shaped titanium phosphate.

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フジミインコーポレーテッド

フジミインコーポレーテッド

Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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