The era is 【SPECIAL PCB!】
Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855
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basic information
Thick copper foil: 70μ, 105μ, 140μ, 400μ Copper inlay: Round type φ1.0 to φ8.0mm, square type ⇒ please consult separately (minimum inner radius φ0.5) Rigid FPC (build structure): 1-4-1, 2-4-2 structure (FPC part is 2-layer structure) Faradflex
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Applications/Examples of results
Mobile devices Various communication equipment AI servers Communication base stations In-vehicle Aerospace Etc.
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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!