Arrow Industries for special substrates (metal substrates, heat dissipation substrates, UV protection substrates)

Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.

<Heat Dissipation Measures with Special Substrates> - Metal (Copper/Aluminum) Bump Substrate A substrate that utilizes the metal bump areas, which remain after etching a copper plate, for heat dissipation. The structure connects heat sinks of UV-LEDs, high-brightness LEDs, and high-power semiconductors directly to the metal bump areas, allowing heat to escape efficiently. - Water-Cooled Flow Path Circuit Substrate A high heat dissipation substrate that integrates a water-cooled heat sink directly onto a metal base substrate. This is effective in situations where standard heat sinks are insufficient for heat dissipation, or for devices like UV-LEDs that have poor conversion efficiency and require essential thermal management. <UV Protection Substrates for UV-LEDs> - Hybrid Substrate A hybrid substrate developed to prevent degradation of connectors due to ultraviolet light, combining a copper base substrate with a glass-epoxy substrate. By partially forming through-holes, it allows for component mounting, such as connectors, on the back side while still being a metal base substrate, thus preventing degradation of components from ultraviolet light. - Inorganic Resist Coated Substrate An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, designed for long-term reliability. It is applied to the substrate as a measure against degradation from UV light and as a high-reflectivity material.

Printed Circuit BoardCircuit board design and manufacturingLED lighting