Implementation of light-emitting and light-receiving elements such as photodiodes and VCSELs (can be supported from one unit).
We offer one-stop service for wire bonding of light-emitting devices from prototype to small-scale production! *Currently providing "High-Density Mounting Specifications" and "Case Studies for Problem Solving."
We propose unique design and implementation know-how using technologies accumulated through various achievements, covering package structures, bonding methods, and material selection. We support flip chip bonding, including C4 bonding, thermal compression using NCP resin, ultrasonic GGI bonding, and AuAu thermal compression. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in bonding methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.
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【Other Contract Development Services】 ■ Procurement of substrates (LTCC/FPC rigid-flex/metal substrates/Si substrates/interposers) ■ Modularization through SMT mixed mounting, as well as support for MEMS and optical devices ■ Wafer processing ■ BGA package reballing and rework ■ Conducting environmental tests such as PCT and TCT collectively to verify reliability 【Case Studies for Problem Solving】 ■ Want to FC but can only obtain chips individually → Bump formation on individual pieces using a bump bonder ■ Implementing in overseas factories but yield is not improving → Reassessing conditions in-house. Reproducing NG and pointing out areas for review *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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![[Data] High-Density Mounting Specifications](https://image.mono.ipros.com/public/catalog/image/01/b0e/786570/IPROS29961909267008707911.jpeg?w=120&h=170)
![[Case Study] COB High-Density Packaging](https://image.mono.ipros.com/public/catalog/image/01/508/405549/IPROS42415345949277545615.jpeg?w=120&h=170)
Company information
This is a company that handles contract manufacturing and sales of image monitoring systems, electronic devices, and system in package located in Okaya City, Nagano Prefecture.
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