Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.
It is compatible with both leaded and lead-free solder.
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Applications/Examples of results
- Evaluation of solder wetting properties of electronic components - Evaluation of wetting properties of commercially available electronic components - Confirmation of solder wetting condition of plated products
Company information
MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!
![[Analysis Case] Solder Wetting Test for Semiconductor Packages](https://image.mono.ipros.com/public/product/image/607/2001013275/IPROS95468510376310513298.jpeg?w=280&h=280)
