A method for removing the surface of a sample by utilizing the sputtering phenomenon, where sample atoms are ejected from the sample surface.
The IP method utilizes the sputtering phenomenon, where sample atoms are ejected from the sample surface when an ion beam with aligned energy and direction is irradiated onto the sample. It is also referred to as the CP method (Cross-section Polish). The ion species used is typically a noble gas (Ar in MST) that does not pose concerns for chemical reactions with the sample. In the AES analysis of the processed surface, the components of the shielding plate (Ni, P) were below the detection limit. ■Features - Wide-area cross-section processing is possible (approximately 500μm to 1mm) - No impact from mechanical polishing damage - Minimal surface contamination - Non-exposure to the atmosphere, cooling processing is possible
Inquire About This Product
basic information
For more details, please contact us.
Price range
Delivery Time
Applications/Examples of results
? Cross-sectional observation of laminated films with different hardness ? Cross-sectional observation of films where delamination occurs at the interface ? Observation of crystal grains (EBSD) ? FIB processing (for TEM observation) and AES analysis
catalog（1）
Download All Catalogs
Company information
MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!