Manufacturing and testing technology for small packages on cutting-edge rationalization lines! Quick and meticulous response.
At High Components Aomori Co., Ltd., we manufacture semiconductors (such as small ICs) that meet various needs of the semiconductor market and are compatible with the IT era. We have established manufacturing lines that can flexibly respond to a diverse range of products, from communication devices represented by mobile phones to home and office applications, as well as industrial uses, supported by production staff that deliver stable, high-quality products. Additionally, we offer a variety of options to meet various demands, from small-scale IC packages to ultra-small packages for transistors. 【Business Activities】 ■ Package assembly ■ Wafer processing (back grinding, dicing) ■ Final testing ■ A wide range of package variations ■ Environmental compliance *For more details, please download the PDF or feel free to contact us.
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【Product Lineup】 ■ QFN・SON Leadless Type ■ Gullwing Type (for Small and Low Signal) ■ Flat Lead Type ■ Board Type *For more details, please download the PDF or feel free to contact us.
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Since its establishment, our company has been responsible for the manufacturing of semiconductor devices (from assembly to testing) alongside the development of the electronics industry. We handle a wide range of processes from wafer processing of semiconductor chips (backgrinding, dicing) to packaging and testing. Additionally, our assembly line operates fully automated, allowing for the selection of different line configurations based on product size and pin count, resulting in high production efficiency and smooth manufacturing from small to large lots without waste.