ハイコンポーネンツ青森 Company Overview

We will meet the various needs of the semiconductor market and the IT era!

Since its establishment, our company has been responsible for the manufacturing of semiconductor devices (from assembly to testing) alongside the development of the electronics industry. We handle a wide range of processes from wafer processing of semiconductor chips (backgrinding, dicing) to packaging and testing. Additionally, our assembly line operates fully automated, allowing for the selection of different line configurations based on product size and pin count, resulting in high production efficiency and smooth manufacturing from small to large lots without waste.