Formic acid molecules approach the work surface and actively remove (reduce) the oxide film.
We would like to introduce our "Flux-less Vacuum Reflow." Instead of flux, formic gas removes the oxide film on the metal surface, eliminating the need for flux cleaning in subsequent processes. (When using solder foil, dedicated paste, etc.) Additionally, by utilizing vacuum and re-pressurization, it effectively reduces solder splash and voids. 【Features】 ■ Direct vaporization of formic acid - High-speed vaporization (4g/sec) - No carrier gas required ■ High-speed heating through radiant heat - Maximum temperature: over 400℃ - High heating efficiency due to radiant heat *For more details, please download the PDF or feel free to contact us.
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【Other Features】 ■ Safe supply and discharge of formic acid - Equipped with our proprietary formic acid decomposition treatment unit - Completely harmless treatment of formic acid in exhaust → No exhaust treatment equipment required *For more details, please download the PDF or feel free to contact us.
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Our company manufactures and sells power supply equipment, semiconductor devices, precision mechanical components, system equipment, and synthetic resin coatings. Leveraging our strengths through a five-business structure consisting of precision mechanical components, coatings, power supply devices, bonding/coating equipment, and power semiconductors, we engage in "proposal-based product development" that values communication with our customers. Additionally, through consulting and dialogue during the development process, we not only meet the functions requested by our customers but also provide new satisfaction with added value.