This is a case of TGV being imaged using transmission and oblique CT with a nano-focus X-ray CT system.
This is a case where TGV (Through Glass Via: Glass Penetrating Electrode) was imaged using transmission imaging and angled CT scanning. The voids inside the Cu filled vias can be clearly observed. The device used for imaging, 'XVA-160αII "Z"', is an ultra-high-resolution nano-focus 3D X-ray CT system. It is an ultra-high-end model that achieves nano-order analysis and can perform CT scanning in just 3.5 minutes thanks to world-class angled CT technology, contributing to improved efficiency in analysis. 【Features】 - A high-end model specialized for higher magnification, capable of analyzing the internal structure of packages. - Equipped with a nano-focus X-ray generator (focus size 200nm and above). - Precisely observes detailed structures at a high magnification of 2,000 times. - Equipped with a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus.
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![[UHS_X-ray CT System Imaging Example] TGV](https://image.mono.ipros.com/public/catalog/image/01/051/801329/IPROS1871632894159375440.png?w=120&h=170)
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Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. In addition to inspecting printed circuit board soldering implementations, we support research, development, and manufacturing across a wide range of fields, including semiconductor products, various electronic devices, automotive components and related industries, materials and composites, and medical-related areas.
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