Laser Cleaner FL-LC Series for Semiconductors

Achieving improved precision in microfabrication and enhanced work efficiency! Surface modification with non-contact laser!

In the microfabrication process of semiconductor manufacturing, the removal of dirt and oxides from component surfaces is a critical issue. Conventional cleaning methods raise concerns about damage from polishing and chemicals, as well as environmental impact. The Laser Cleaner FL-LC series addresses these challenges with non-contact cleaning using a high-power laser beam. 【Application Scenarios】 - Microfabrication process in semiconductor manufacturing - Removal of dirt and oxides from component surfaces - Polishing of fine irregularities - Surface treatment before adhesion - Surface modification of substrates and devices - Surface hardening treatment - Adjustment of surface roughness - Pattern formation 【Benefits of Implementation】 - Achieves faster and higher quality surface treatment compared to conventional cleaning methods - Minimizes damage to components, contributing to improved product quality - Reduces environmental impact - Cost reduction through improved work efficiency

Other cleaning machines